Simulation and experimental determination of the macro-scale layer thickness distribution of electrodeposited Cu-line patterns on a wafer substrate

Author: Pantleon Karen   Bossche Bart   Purcar Marius   Bariani Paolo   Floridor Gert  

Publisher: Springer Publishing Company

ISSN: 0021-891X

Source: Journal of Applied Electrochemistry, Vol.35, Iss.6, 2005-06, pp. : 589-598

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