Exploiting Microscale Roughness on Hierarchical Superhydrophobic Copper Surfaces for Enhanced Dropwise Condensation

Publisher: John Wiley & Sons Inc

E-ISSN: 2196-7350|2|3|n/a-n/a

ISSN: 2196-7350

Source: ADVANCED MATERIALS INTERFACES (ELECTRONIC), Vol.2, Iss.3, 2015-02, pp. : n/a-n/a

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Abstract