Erratum: Top-down silicon microcantilever with coupled bottom-up silicon nanowire for enhanced mass resolution (2015 Nanotechnology 26 145502)

By Vidal-Álvarez Gabriel   Agustí Jordi   Torres Francesc   Abadal Gabriel   Barniol Núria   Llobet Jordi   Sansa Marc   Fernández-Regúlez Marta   Pérez-Murano Francesc   Gottlieb Oded   Vidal-Álvarez Gabriel  

Nanotechnology, Vol. 26, Iss. 25, 2015-06 ,pp. : 259601-259601

IOP Publishing

Access to resources Recommend Favorite

Large initial compressive stress in top-down fabricated silicon nanowires evidenced by static buckling

By Roux X Le   Parrain F   Bosseboeuf A   Allain P E  

Journal of Micromechanics and Microengineering, Vol. 23, Iss. 1, 2013-01 ,pp. : 15014-15021

IOP Publishing

Access to resources Recommend Favorite

A new bottom-up methodology to produce silicon layers with a closed porosity nanostructure and reduced refractive index

By Godinho V   Caballero-Hernández J   Jamon D   Rojas T C   Schierholz R   García-López J   Ferrer F J   Fernández A  

Nanotechnology, Vol. 24, Iss. 27, 2013-07 ,pp. : 275604-275613

IOP Publishing

Access to resources Recommend Favorite

A novel bottom–up copper filling of blind silicon vias in 3D electronic packaging

By Du Li   Shi Tielin   Su Lei   Xue Dongmin   Liao Guanglan  

Journal of Micromechanics and Microengineering, Vol. 25, Iss. 4, 2015-04 ,pp. : 45005-45011

IOP Publishing

Access to resources Recommend Favorite

Seebeck Coefficient Characterization of Highly Doped n - and p -Type Silicon Nanowires for Thermoelectric Device Applications Fabricated with Top-Down Approach

By Kim Jaehyeon   Hyun Younghoon   Park Youngsam   Choi Wonchul   Kim Soojung   Jeon Hyojin   Zyung Taehyeong   Jang Moongyu  

Journal of Nanoscience and Nanotechnology, Vol. 13, Iss. 9, 2013-09 ,pp. : 6416-6419

American Scientific Publishers

Access to resources Recommend Favorite