Thin Film Thermoelectric Metal–Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity

Publisher: John Wiley & Sons Inc

E-ISSN: 1521-4095|27|22|3453-3459

ISSN: 0935-9648

Source: ADVANCED MATERIALS, Vol.27, Iss.22, 2015-06, pp. : 3453-3459

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract