Opto-Electronic Packaging ( Optoelectronics - Advanced Materials and Devices )

Publication series ： Optoelectronics - Advanced Materials and Devices

Author： Ulrich H. P. Fischer

Publisher： IntechOpen‎

Publication year： 2013

E-ISBN: INT0346351626

P-ISBN(Paperback): 9789535109228

P-ISBN(Hardback): 9789535109228

Subject： TN4 microelectronics, integrated circuit (IC)

Keyword：微电子学、集成电路（IC）

Language： ENG

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Opto-Electronic Packaging

Chapter

Chapter 17 Opto-Electronic Packaging

1. Introduction

2. Fiber-chip coupling

3. Basic coupling concepts

4. Adaptation of mode fields

5. Active adjusting techniques

6. Passive adjusting techniques

6.1. Flip-chip-technique

6.2. Optical board technology

7. Optical connectors

7.1. Single fiber connectors

7.2. Multi-fiber connectors

8. Modules

8.1. Fiber-chip coupling in modules

8.2. Multimode fiber coupling

8.3. Singlemode-fiber coupling

8.4. Transmitter and receiver modules

8.5. Transceiver modules

8.6. Sensor and passive devices modules

9. Reliability requirements

10. Conclusion

Author details

References

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