Comparison of analysis methods for package-induced stresses on moulded Hall sensors

Author: Fischer Sebastian   Beyer Harald   Janke Ralf   Hartwig Stefan   Wilde Jürgen  

Publisher: Springer Publishing Company

ISSN: 0946-7076

Source: Microsystem Technologies, Vol.12, Iss.10-11, 2006-09, pp. : 1005-1009

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