Producing fine pitch substrate of COF by semiadditive process and pulse reverse plating of Cu

Author： He W.   Cui H.   Mo Y. Q.   Wang S. X.   He B.   Hu K.   Guan J.   Liu S. L.   Wang Y.  

Publisher： Maney Publishing

ISSN： 0020-2967

Source： Transactions of the Institute of Metal Finishing, Vol.87, Iss.1, 2009-01, pp. : 33-37

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