Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition

Author： Leong Yee Mei   Haseeb A.S.M.A.  

Publisher： MDPI

E-ISSN： 1996-1944|9|7|522-522

ISSN： 1996-1944

Source： Materials, Vol.9, Iss.7, 2016-06, pp. : 522-522

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