Seed layer corrosion of damascene structures in copper sulfonate electrolytes

Author： Martyak N.M.   Ricou P.  

Publisher： Elsevier

ISSN： 0254-0584

Source： Materials Chemistry and Physics, Vol.84, Iss.1, 2004-03, pp. : 87-98

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Characterisation of copper inductors fabricated by dual damascene and electroplating techniques

By Toh B.   McNeill D.   Gamble H.  

Journal of Materials Science: Materials in Electronics, Vol. 16, Iss. 4, 2005-04 ,pp. : 233-238

Springer Publishing Company

Access to resources Recommend Favorite

Corrosion of Copper Microalloyed with Yttrium

By Neklyudov I. M.   Sytin V. I.   Voevodin V. N.   Shevchenko S. V.   Lopata A. T.   Rybal'chenko N. D.  

Materials Science, Vol. 39, Iss. 5, 2003-09 ,pp. : 740-744

Springer Publishing Company

Access to resources Recommend Favorite

Effect of corrosion product layer on SCC susceptibility of copper containing type 304 stainless steel in 1 M H 2 SO 4

By Asawa M.   Devasenapathi A.   Fujisawa M.  

Materials Science and Engineering: A, Vol. 366, Iss. 2, 2004-02 ,pp. : 292-298

Elsevier

Access to resources Recommend Favorite

Corrosion Resistance of Zinc Coatings Deposited from Electrolytes by a Pulse Current

By Kostin M.O.   Sheikina O.H.  

Materials Science, Vol. 37, Iss. 1, 2001-01 ,pp. : 128-133

Springer Publishing Company

Access to resources Recommend Favorite

Anodic Behavior of Titanium in Acid Sulfate Electrolytes for Copper Plating

By Khoma M.S.   Pomaniv O.M.   Kuntyi O.I.   Tymchyshyn A.I.  

Materials Science, Vol. 36, Iss. 5, 2000-09 ,pp. : 780-783

Springer Publishing Company

Access to resources Recommend Favorite