Application of linear annealing method to Si&unknown;&unknown;SiO 2 /Si wafer direct bonding

Author: Lee J.W.   Kang C.S.   Song O.S.   Kim C.K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.394, Iss.1, 2001-08, pp. : 271-275

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Abstract