Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Author： Mallik S.   Schmidt M.   Bauer R.   Ekere N.N.  

Publisher： Emerald Group Publishing Ltd

ISSN： 0954-0911

Source： Soldering & Surface Mount Technology, Vol.22, Iss.4, 2010-09, pp. : 42-49

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Correlation of solder paste rheology with computational simulations of the stencil printing process

By Durairaj R   Jackson G.J.   Ekere N.N.   Glinski G   Bailey C  

Soldering & Surface Mount Technology, Vol. 14, Iss. 1, 2002-01 ,pp. : 11-17

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Correlation between jamming and skipping during solder paste printing

By Hillman S.R.   Mannan S.H.   Durairaj R   Seman A   Ekere N.N.   Dusek M   Hunt C  

Soldering & Surface Mount Technology, Vol. 17, Iss. 4, 2005-04 ,pp. : 17-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Engineering solder paste performance through controlled stress rheology analysis

By Bao Xiaohua   Lee Ning-Cheng   Raj Rajkumar B   Rangan K.P.   Maria Anu  

Soldering & Surface Mount Technology, Vol. 10, Iss. 2, 1998-02 ,pp. : 26-35

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A study of solder paste printing requirements for CSP technology

By Kennedy Jeff  

Soldering & Surface Mount Technology, Vol. 12, Iss. 3, 2000-12 ,pp. : 13-19

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Characterization of a solder paste printing process and its optimization

By Poon Gary K.K.   Williams D.J.  

Soldering & Surface Mount Technology, Vol. 11, Iss. 3, 1999-12 ,pp. : 23-26

Emerald Group Publishing Ltd

Access to resources Recommend Favorite