Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi, Sb, P, Ag, and Cu on 60Sn–40Pb solder

Author: Carroll M. A.   Warwick M. E.  

Publisher: Maney Publishing

ISSN: 1743-2847

Source: Materials Science and Technology, Vol.3, Iss.12, 1987-12, pp. : 1040-1045

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract