

Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2015|825|142-149
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2015, Iss.825, 2015-08, pp. : 142-149
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content




The deposition of diamond film with high thermal conductivity
By Gu C. Jin Z. Lu X. Zou G. Zhang J. Fang R.
Thin Solid Films, Vol. 311, Iss. 1, 1997-12 ,pp. :



