A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate

Author: Shiyan Fan   Enhai Liu   Jun Zhang   Yuling Liu   Lei Wang   Kai Lin   Ming Sun   Lukui Shi  

Publisher: IOP Publishing

ISSN: 1674-4926

Source: Journal of Semiconductors, Vol.36, Iss.9, 2015-09, pp. : 96001-96006

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Abstract