A Study on the Reliability of Micro-Vias in Printed Circuit Boards During Thermal Cycling

Author: Ko Youngbae   Park Hyungpil   Park Gyunmyoung   Cho Seunghyun  

Publisher: American Scientific Publishers

ISSN: 1936-6612

Source: Advanced Science Letters, Vol.19, Iss.12, 2013-12, pp. : 3683-3687

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Abstract