Three-dimensional wafer-scale copper chemical-mechanical planarization model

Author: Thakurta D.G.   Schwendeman D.W.   Gutmann R.J.   Shankar S.   Jiang L.   Gill W.N.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.414, Iss.1, 2002-07, pp. : 78-90

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Abstract