Microelectronics International,volume 14,issue 3  (03-2016)

Period of time: 2016年3期

Publisher: Emerald Group Publishing Ltd

Founded in: 1982

Total resources: 58

ISSN: 1356-5362

Subject: TN Radio Electronics, Telecommunications Technology

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Microelectronics International,volume 14,issue 3

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Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps*

By S.Honma, K.Tateyama**, H.Yamada**, K.Doi, N.Hirano, T.Okada, H.Aoki, Y.Hiruta,Sudo*** T in (1997)

Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp. 47-50

Emerald Group Publishing Ltd

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