Period of time: 2016年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1982
Total resources: 58
ISSN: 1356-5362
Subject: TN Radio Electronics, Telecommunications Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Microelectronics International,volume 14,issue 3
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AIN LGAs for High Performance Packaging Applications
By Iwase N,** J Ewanich in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.By Park J.Y.,Allen M.G. in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.Novel Epoxy-based Compositions for Microelectronics Packaging Applications: Part I*
By Ghoshal R,Sambasivam M, P.K.Mukerji** in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.By Itagaki M,Bessho Y,Eda K,Ishida T in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.Fatigue Properties of BGA Solder Joints: A Comparison of Thermal and Power Cycle Tests*
By Albrecht H.-J.,Gamalski J in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.Tomorrow's Packaging - Chip Scale Packaging vs Flip Chip*
By Boustedt K,Vardaman** E.J. in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.Effectiveness of Thin-film Barrier Metals for Eutectic Solder Bumps*
By S.Honma, K.Tateyama**, H.Yamada**, K.Doi, N.Hirano, T.Okada, H.Aoki, Y.Hiruta,Sudo*** T in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.Advanced Thick-film Technology - The New Generation*
By Barnwell P,Wood J in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.By Coupier P,Peltier J Ph.,Pilat E in (1997)
Microelectronics International,volume 14,issue 3 , Vol. 14, Iss. 3, 1997-03 , pp.