Period of time: 2016年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1982
Total resources: 58
ISSN: 1356-5362
Subject: TN Radio Electronics, Telecommunications Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Microelectronics International,volume 16,issue 2
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Analysis of packaging and sealing techniques for microelectronic modules and recent advances
By Khanna P.K.,Bhatnagar S.K.,Gust W in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.Low cost prototyping of multichip modules - the European INCO-Copernicus project
By Illyefalvi-Vitéz Zsolt,Vervaet Alfons,Van Calster André,Sinnadurai Nihal,Hrovat Marko,Svasta Paul,Tóth Endre,Belavic Darko,Ionescu Radu Mihai,Dennehy William in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.Smart sensors for industrial applications
By Prosser Stephen J,Schmidt Ernest D.D. in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.By Lau John,Chen Tony in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.By Gilleo Ken,Ongley Peter in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.By Gilleo Ken,Witt Matthew,Blumel David,Ongley Peter in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.Anisotropic conducting adhesives for electronic assembly
By Whalley David C,Mannan Samjid H,Williams David J in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.Interconnect solutions for advanced area array packaging
By Hendriksen M.W.,Frimpong F.K.,Ekere N.N. in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.Low cost high-density multilayer circuits for MCM-C
By Born I,Detemmerman D,Vrana M,Baets J De,Van Calster A in (1999)
Microelectronics International,volume 16,issue 2 , Vol. 16, Iss. 2, 1999-02 , pp.