Period of time： 2016年2期
Publisher： Emerald Group Publishing Ltd
Founded in： 1982
Total resources： 58
ISSN： 1356-5362
Subject： TN Radio Electronics, Telecommunications Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Microelectronics International,volume 24,issue 2
Menu
Simulation, design, development and test of antennas for wireless sensor network systems
By O'Flynn Brendan,Laffey D.,Buckley J.,Barton J.,O'Mathuna S.C. in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.
Access to resources
Recommend
Thick film NTC thermistor for wide range of temperature sensing
By Jagtap Shweta,Rane Sunit,Mulik Uttamrao,Amalnerkar Dinesh in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.Fabrication and characterization of bulk and thick film perovskite NTC thermistors
By Kulawik J.,Szwagierczak D.,Gröger B.,Skwarek A. in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.By Kalita Wlodzimierz,Kamuda Kazimierz in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.Graphical touch screen of thermal signs for the blind people ‐ clinic tests
By Boron Krzysztof,Bratek Piotr,Kos Andrzej in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.By Lawson Wayne,Pilkington R.D.,Hill A.E. in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.A useful pseudo-logarithmic circuit
By Maundy Brent,Westwick David,Gift Stephan in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.A 1.2?V single supply operational amplifier design using 0.13? µ m technology
By Ramakrishnan Radhalakshmi,Chaudhry Maqsood A. in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.Future VLSI interconnects: optical fiber or carbon nanotube ‐ a review
By Kaushik Brajesh Kumar,Goel Saurabh,Rauthan Gaurav in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.Optimization of reflow soldering process for BGA packages by artificial neural network
By Lin Yu-Hsin,Deng Wei-Jaw,Shie Jie-Ren,Yang Yung-Kuang in (2007)
Microelectronics International,volume 24,issue 2 , Vol. 24, Iss. 2, 2007-04 , pp.