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By SomerJakubDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic ŠtekovičMichalDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic UrbanFrantišekDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic ŠanderaJosefDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic SzendiuchIvanDepartment of Microelectronics Brno University of Technology FEEC Brno Czech Republic in Soldering & Surface Mount Technology
ISSN:0954-0911|27|4|157-163
Emerald Group Publishing Ltd(2015)
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