The Failure Mechanism of Recrystallization – Assisted Cracking of Solder Interconnections‎

By Toni T. Mattila and Jorma K. Kivilahti  

ISBN:INT0202837899

IntechOpen‎(2012)‎

Access to resources Favorite 7.4546947

By Li Jue   Xu Hongbo   Hokka Jussi   Mattila Toni T.   Chen Hongtao   Paulasto-Kröckel Mervi   in Soldering & Surface Mount Technology

ISSN:0954-0911|23|3|161-167

Emerald Group Publishing Ltd‎(2011)‎

Access to resources Favorite 5.0855885

Simulation of Dynamic Recrystallization in Solder Interconnections During Thermal Cycling‎

By Jue Li 2 A01 Tomi Laurila 3 A01 Toni T. Mattila 4 A01 Hongbo Xu and Mervi Paulasto- Kröcke  

ISBN:INT5603153820

IntechOpen‎(2013)‎

Access to resources Favorite 4.406468

By Huvet M.   Toni T.   Sheng X.   Thorne T.   Jovanovic G.   Engl C.   Buck M.   Pinney J.W.   Stumpf M.P.H.   in Molecular Biology and Evolution

ISSN:0737-4038|28|3|1141-1155

Oxford University Press‎(2011)‎

Access to resources Favorite 3.7273474