Author： Garcia Nieto P.J.
Publisher： Taylor & Francis Ltd
ISSN： 0020-7160
Source： International Journal of Computer Mathematics, Vol.86, Iss.4, 2009-04, pp. : 640-664
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
By Shimizu K. Noguchi T. Seitoh H. Okada M. Matsubara Y.
Wear, Vol. 250, Iss. 1, 2001-10 ,pp. :
Access to resources
Recommend
Simulation Analysis of HPDC Process with Automobile Part by CAE
Materials Science Forum, Vol. 2014, Iss. 804, 2015-01 ,pp. :
Failure modes and FEM analysis of power electronic packaging
Finite Elements in Analysis and Design, Vol. 38, Iss. 7, 2002-05 ,pp. :
Study of recyclable polymer automobile undercoatings containing PVC using TG/FTIR
By Post E. Rahner S. Mohler H. Rager A.
Thermochimica Acta, Vol. 263, Iss. unknown, 1995-10 ,pp. :