Subcritical Delamination in Epoxy Bonds to Silicon and Glass Adherends: Effect of Temperature and Preconditioning

ISSN： 0021-8464

Source： Journal of Adhesion, Vol.84, Iss.7, 2008-07, pp. : 619-637

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of Silane Adhesion Promoters on Subcritical Debonding of Epoxy/Glass Interfaces After Hygrothermal Aging

By Onjun Orasa Pearson Raymond

Journal of Adhesion, Vol. 86, Iss. 12, 2010-12 ,pp. : 1178-1202

Taylor & Francis Ltd

Access to resources Recommend Favorite

Effect of Cure Temperature on the Glass Transition Temperature and Mechanical Properties of Epoxy Adhesives

By Carbas R. J. C. Marques E. A. S. da Silva L. F. M. Lopes A. M.

Journal of Adhesion, Vol. 90, Iss. 1, 2014-01 ,pp. : 104-119

Taylor & Francis Ltd

Access to resources Recommend Favorite

Enhancement in the Glass Transition Temperature in Latent Thiol-Epoxy Click Cured Thermosets

By Guzmán Dailyn Ramis Xavier Fernández-Francos Xavier Serra Angels

Polymers, Vol. 7, Iss. 4, 2015-04 ,pp. : 680-694

MDPI

Access to resources Recommend Favorite

Effect of Cutting Parameters on the Delamination

Polymers Research Journal, Vol. , Iss. , 2016-10 ,pp. : 11-12

Nova Science Publishers, Inc.

Access to resources Recommend Favorite

Relationship Between Interfacial Water Layer Adhesion Loss of Silicon/Glass Fiber-Epoxy Systems: A Quantitative Study

By Nguyen Tinh Byrd W. Eric Alshed David Chin Joannie Clerici Cyril Martin Jon

Journal of Adhesion, Vol. 83, Iss. 6, 2007-06 ,pp. : 587-610

Taylor & Francis Ltd

Access to resources Recommend Favorite