Novel Fast-Curing Electrically Conductive Adhesives from a Functional Epoxy and Micro Silver Flakes: Preparation, Characterization, and Humid-Thermal Aging

Author： Cui Hui-Wang   Du Wen-Hui  

Publisher： Taylor & Francis Ltd

ISSN： 0021-8464

Source： Journal of Adhesion, Vol.89, Iss.9, 2013-09, pp. : 714-726

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