Author: Leipner H. S. Scholz R. F. Syrowatka F. Schreiber J. Werner P.
Publisher: Taylor & Francis Ltd
ISSN: 0141-8610
Source: Philosophical Magazine. A. Physics of Condensed Matter. Defects and Mechanical Properties, Vol.79, Iss.11, 1999-11, pp. : 2785-2802
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Titanium nitride diffusion barrier for copper metallization on gallium arsenide
By Chen H.C. Tseng B.H. Houng M.P. Wang Y.H.
Thin Solid Films, Vol. 445, Iss. 1, 2003-11 ,pp. :