Steady-state crack growth along a grain boundary in interconnects with a high electric field intensity

Author: Wang W.-L.   Lee Sanboh   Chuang T.-J.  

Publisher: Taylor & Francis Ltd

ISSN: 0141-8610

Source: Philosophical Magazine. A. Physics of Condensed Matter. Defects and Mechanical Properties, Vol.82, Iss.5, 2002-03, pp. : 955-970

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Abstract