Numerical Simulation of Heat Transfer in a Three-Dimensional Enclosure with Three Chips in Various Position Arrangements

Author： Chuang Shu-Hao Chiang Jiunn-Shean Kuo Yuan-Ming

Publisher： Taylor & Francis Ltd

ISSN： 1521-0537

Source： Heat Transfer Engineering, Vol.24, Iss.2, 2003-03, pp. : 42-59

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