SIMULATION OF METAL DROPLET DEPOSITION WITH SOLIDIFICATION INCLUDING UNDERCOOLING AND CONTACT RESISTANCE EFFECTS

Author: Chung M.   Rangel R. H.  

Publisher: Taylor & Francis Ltd

ISSN: 1521-0634

Source: Numerical Heat Transfer Part A: Applications, Vol.37, Iss.3, 2000-02, pp. : 201-226

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Abstract