THERMAL STRESSES FOR BONDED DISSIMILAR MATERIALS WITH A CIRCULAR-ARC ANTICRACK

Author: Shen M. H.   Chao C. K.  

Publisher: Taylor & Francis Ltd

ISSN: 0149-5739

Source: Journal of Thermal Stresses, Vol.22, Iss.7, 1999-09, pp. : 637-657

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Abstract