THERMOELASTIC ANALYSIS OF W-Cu FUNCTIONALLY GRADED MATERIALS SUBJECTED TO A THERMAL SHOCK USING A MICROMECHANICAL MODEL

Author: Ueda Sei  

Publisher: Taylor & Francis Ltd

ISSN: 0149-5739

Source: Journal of Thermal Stresses, Vol.24, Iss.1, 2001-01, pp. : 19-46

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Abstract