Near-Wall Liquid Layering, Velocity Slip, and Solid-Liquid Interfacial Thermal Resistance for Thin-Film Evaporation in Microchannels

Author: Zhao Jun-Jie   Huang Mei   Min Qi   Christopher David   Duan Yuan-Yuan  

Publisher: Taylor & Francis Ltd

ISSN: 1556-7265

Source: Nanoscale and Microscale Thermophysical Engineering, Vol.15, Iss.2, 2011-04, pp. : 105-122

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Abstract