Effect of oxides on the adhesion of Cu films deposited onto stainless steel by electron shower and thermal evaporation methods

Author： Yumoto H. Shimada S. Minami C. Inoue T. Li S.J. Ishihara M.

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.11, Iss.5, 1997-01, pp. : 665-677

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