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Effect of Curing Procedures on the Electrical Properties of Epoxy-Based Isotropic Conductive Adhesives

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International Journal of Polymeric Materials, Vol. 60, Iss. 6, 2011-01 ,pp. : 409-427

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The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

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Anisotropic alignment of nickel particles in a magnetic field for electronically conductive adhesives applications

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Journal of Adhesion Science and Technology, Vol. 11, Iss. 2, 1997-01 ,pp. : 155-166

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Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes

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