Analysis and evaluation of bondline thickness effects on failure load in adhesively bonded structures

Author: Gleich D. M.   Van Tooren M. J. L.   Beukers A.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.15, Iss.9, 2001-09, pp. : 1091-1101

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Abstract