Adhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasma

Author: Zheng S.   Entenberg A.   Takacs G. A.   Egitto F. D.   Matienzo L. J.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.17, Iss.13, 2003-12, pp. : 1801-1813

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