In situ cure monitoring of adhesively bonded joints by dielectrometry

Author: Kwon Jae Wook   Chin Woo Seok   Lee Dai Gil  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.17, Iss.16, 2003-12, pp. : 2111-2130

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Abstract