The role of water in delamination in electronic packages: degradation of interfacial adhesion

Author： Leung S.Y.Y.   Lam D.C.C.   Luo Shijian   Wong C.P.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.18, Iss.10, 2004-09, pp. : 1103-1121

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