Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds

Author: Moon Kyoung-Sik   Rockett Chris   Wong C. P.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.18, Iss.2, 2004-02, pp. : 153-167

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Abstract