A novel cumulative fatigue damage model for electronically-conductive adhesive joints under variable loading

By Gomatam Rajesh R.   Sancaktar Erol  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 1, 2006-01 ,pp. : 69-86

Taylor & Francis Ltd

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A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loading

By Gomatam Rajesh R.   Sancaktar Erol  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 1, 2006-01 ,pp. : 87-104

Taylor & Francis Ltd

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Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

By Yim Myung Jin  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1593-1630

Taylor & Francis Ltd

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Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis

By Lin Y. C.   Chen X.   Wang Z. P.  

Journal of Adhesion Science and Technology, Vol. 20, Iss. 12, 2006-09 ,pp. : 1383-1399

Taylor & Francis Ltd

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Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging Applications

By Lin Y. C.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1631-1657

Taylor & Francis Ltd

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