Synthesis of polyimides containing pyridine or triazole moiety to improve their adhesion to sputter-deposited copper

Author: Ku Chun-Kang   Ho Chang-Hong   Lee Yu-Der  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.19, Iss.11, 2005-10, pp. : 909-925

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Abstract