Author: Cheng W. T. Chih Y. W. Lin C. W.
Publisher: Taylor & Francis Ltd
ISSN: 1568-5616
Source: Journal of Adhesion Science and Technology, Vol.19, Iss.7, 2005-06, pp. : 511-523
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Abstract
UV-light-curable electrically conductive pastes have been formulated from granular silver particles and flake-shaped silver and epoxyacrylate, ethylene glycol and photo-initiator in this study. These conductive pastes were analyzed using photo-DSC, TGA and conductivity metry for reaction rate during photo-polymerization process, thermal resistance and conductivity, respectively. It is shown that (1) the rate of photo-polymerization can be regulated by varying the exposure dose and time depending on the particle size and particle loading; (2) the resistance of the paste containing 60 wt% silver with mean particle size from 0.6 to 1.5
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