Study of Interfacial Moisture Diffusion at Epoxy/Cu Interface

Author: Chan Edward K. L.   Yuen Matthew M. F.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.23, Iss.9, 2009-06, pp. : 1253-1269

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content