Fatigue Behavior of Electrically Conductive Adhesives

By Su Bin   Qu Jianmin  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 927-946

Taylor & Francis Ltd

Access to resources Recommend Favorite

Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications

By Matienzo L. J.   Das R. N.   Egitto F. D.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 853-869

Taylor & Francis Ltd

Access to resources Recommend Favorite

Drop Test Performance of Isotropic Electrically Conductive Adhesives

By Morris James E.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 14, 2008-09 ,pp. : 1699-1716

Taylor & Francis Ltd

Access to resources Recommend Favorite

Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives

By Lewis H. J.   Ryan A.  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 893-913

Taylor & Francis Ltd

Access to resources Recommend Favorite

Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives

By Zhou Jianguo   Sancaktar Erol  

Journal of Adhesion Science and Technology, Vol. 22, Iss. 8-9, 2008-06 ,pp. : 947-956

Taylor & Francis Ltd

Access to resources Recommend Favorite