Bonding kinetics of thermosetting adhesive systems used in wood-based composites: the combined effect of temperature and moisture content

Author： Humphreyt Philip E. Shan Ren

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.3, Iss.1, 1989-01, pp. : 397-413

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