Adhesion strength of copper thin-films to a E24 carbon steel: effects of substrate surface ion bombardment etching

By Cailler M.  

Journal of Adhesion Science and Technology, Vol. 7, Iss. 2, 1993-01 ,pp. : 141-157

Taylor & Francis Ltd

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Adhesion strength of plasma-assisted CVD B(C,N) film to silicon substrate

By Nakamura S.  

Journal of Adhesion Science and Technology, Vol. 13, Iss. 5, 1999-01 ,pp. : 615-627

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Effect of Air–Plasma Pre-treatment of Si Substrate on Adhesion Strength and Tribological Properties of a UHMWPE Film

By Samad M. Abdul   Satyanarayana Nalam   Sinha Sujeet K.  

Journal of Adhesion Science and Technology, Vol. 24, Iss. 15-16, 2010-10 ,pp. : 2557-2570

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Adhesion enhancement of thin copper film on polyimide modified by oxygen reactive ion beam etching

By Paik Kyung W.   Ruoff Arthur L.  

Journal of Adhesion Science and Technology, Vol. 4, Iss. 1, 1990-01 ,pp. : 465-474

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Preparation of a Nickel Ion Containing Langmuir–Blodgett Multilayer and an Ultra-Thin Nickel Film Deposited on an Interpenetrating Polymer Network Substrate

By Tang Dongyan  

Journal of Adhesion Science and Technology, Vol. 24, Iss. 6, 2010-05 ,pp. : 1055-1062

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