Improving the resolution of ultrasonic echoes from thin bondlines using cepstral processing

Author： Dewen P.N.   Pialucha T.P.   Cawley P.  

Publisher： Taylor & Francis Ltd

ISSN： 1568-5616

Source： Journal of Adhesion Science and Technology, Vol.5, Iss.8, 1991-01, pp. : 667-689

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