Effect of ion irradiation and heat treatment on adhesion in the Cu / Teflon system

Author: Wang L.   Angert N.   Trautmann C.   Vetter J.  

Publisher: Taylor & Francis Ltd

ISSN: 1568-5616

Source: Journal of Adhesion Science and Technology, Vol.9, Iss.12, 1995-01, pp. : 1523-1529

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract