Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB

Author: Weiss Dieter G  

Publisher: Emerald Group Publishing Ltd

ISSN: 0305-6120

Source: Circuit World, Vol.24, Iss.2, 1998-02, pp. : 6-9

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract