Manufacture of high density interconnection substrates by co-lamination of inner layers and programmed interconnection joining layers

Author： Fjelstad Joseph   Karavakis Konstantine   Haba Belgacem  

Publisher： Emerald Group Publishing Ltd

ISSN： 0305-6120

Source： Circuit World, Vol.25, Iss.3, 1999-03, pp. : 9-12

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