Author： Morse Gary
Publisher： Emerald Group Publishing Ltd
ISSN： 0305-6120
Source： Circuit World, Vol.28, Iss.2, 2002-06, pp. : 19-23
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Access to resources
Recommend
An Introduction to Soldering: Part 1
Circuit World, Vol. 10, Iss. 1, 1993-12 ,pp. :
Advanced Metal Core Substrates as a Solution for Multichip Module Backplanes
By Buck T.J.
Circuit World, Vol. 18, Iss. 2, 1993-12 ,pp. :
The Resistance of Space-Quality Solder Joints to Thermal Fatigue: Part 1
By Dunn B.D.
Circuit World, Vol. 5, Iss. 4, 1993-12 ,pp. :
Printed Circuit World Convention V: 12–15 June 1990, Glasgow, Scotland Part 1
Circuit World, Vol. 17, Iss. 1, 1993-12 ,pp. :